A study on pre-bonding mechanism of Si wafer at HF pre-treatment

Title
A study on pre-bonding mechanism of Si wafer at HF pre-treatment
Authors
강경두박진성이채봉주병권정귀상
Keywords
FEA
Issue Date
1999-07
Publisher
1999 년도 대한전기학회 하계학술대회 논문집
Citation
, 3313-3315
URI
http://pubs.kist.re.kr/handle/201004/17908
Appears in Collections:
KIST Publication > Conference Paper
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