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Issue DateTitleAuthor(s)
199701New packaging method of field emission display using silicon-to-ITO coated glass bonding정지원; 주병권; 최우범; 이덕중; 이윤희; 이남양; Seong Jae Jung; 최두진; 오명환
199703Modified low-temperature direct bonding method for vacuum microelectronics application주병권; 이덕중; 최우범; 이윤희; 장진; 이광배; 오명환
199811Glass-to-glass electrostatic bonding for FED tubeless packaging application주병권; 최우범; 이윤희; 정성재; 이남양; 한정인; 조경익; 오명환
199802Fabrication and characteristics of microelectromechanical system device based on PZT films and surface micromachining윤영수; 김준한; M. T. Hsieh; D. L. Polla
199803Characteristics of Pb(Zr0.53Ti0.47)O3 films deposited by metalorganic decomposition on Pt/Ti/TiO2/polysilicon/Si3N4/Si for pizoelectric microelectromechanical system devices김준한; 윤영수; D. L. Polla
199802Annealing process of Pt/Ti/TiO2/polysilicon/Si3N4/Si-wafer using as a substrate of Pb(Zr0.53Ti0.47)O3 thin films for piezoelectric microelectromechanical system devices김준한; 윤영수; Dennis L. Polla
199812Influence of interface structure on chemical etching process for air gap of microelectromechanical system based on surface micromachining윤영수; 김준한; D. L. Polla; 신영화
199804Vacuum packaging of field emitter array using electrostatically-bonded glass-Si-glass/glass-glass structure주병권; 이덕중; 정지원; 김훈; 이상조; 이남양; 장진; 오명환
199804Patterning 된 전극을 이용한 4 인치 Glass-to-Silicon wafer 의 정전 열 접합 .이덕중; 주병권; 이윤희; 정지원; 장진; 오명환
199807Tubeless packaging of field emission display using glass to glass electrostatic bonding technology정지원; 주병권; 이덕중; 이윤희; N. Y. Lee; Y. W. Ko; Y. G. Moon; 최두진; 오명환

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