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Issue DateTitleAuthor(s)
200001Study on glass-to-silicon anodic bonding using hydrophilic process주병권; 이덕중; 장진; 오명환
200004A tubeless AC-plasma display panel(PDP) packaged by electrostatic bonding technology이덕중; 주병권; 정진욱; 김영조; 최은하; 김태영; 장진; 이윤희
200006Application of electrostatic bonding to field emission display vacuum packaging이덕중; 이남양; 정성재; 김관수; 이윤희; 장진; 주병권
200005New vacuum packaging using wire-heater and optical fiber spacer for FED이덕중; 주병권; 오명환; 장진; 이윤희
200011Effect of substrate temperature on etched feature of thin chromium film and its application서상원; 김훈; 박종원; 이윤희; 박공석; 정재훈; 장진; 김동호; 오명환; 김남수; 주병권; 김훈
200001Glass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stability이덕중; 주병권; 장진; 오명환; 이윤희
200011Development of cold cathode-cathode ray tube (CC-CRT) using Mo-tip field emitter array(FEAs)박종원; 김훈; 서상원; 이윤희; 박공석; 정재훈; 장진; 김남수; 김동호; 주병권
200011Thin PDP packaging by glass-bonding techonlogy and its driving properties이덕중; 주병권; 정진욱; 박흥우; 이윤희; 김영조; 조태성; 최은하; 장진; 오명환
200009Effect of the hybrid-etching methods on the field emission characteristics of Mo-tip field emitter arrays서상원; 김훈; 박종원; 주병권; 박공석; 정재훈; 김동호; 장진; 오명환; 김남수; 이윤희
200001Thin PDP packaging technology in low temperature and emission characteristics주병권; 이덕중; 정진욱; 김영조; 최은하; 장진; 오명환

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