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Issue DateTitleAuthor(s)
200110RF-MEMS package with vertical via hole for low loss characteristicYun-Kwon Park; Heung-Woo Park; Duck-Jung Lee; Jung-Ho Park; Chung-Woo Kim; Ci-Moo Song; Chul-Ju Kim; 주병권
200107New plasma display panel packaging technology using electrostatic bonding methodDuck-Jung Lee; Jin-Wook Jeong; Young-Cho Kim; 이윤희; 주병권; Tae-Seung Cho; Eun-Ha Choi; Jin Jang
200108Vacuum in-line packaging technology of AC-PDP using direct-joint methodDuck-Jung Lee; Seung-Il Moon; 이윤희; 주병권; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang
200108Flat lamp packaging technology using carbon nano tubesDuck-Jung Lee; 이윤희; 주병권; Jae-Eun Yoo; Byung-Don Min; Jeung-Hoon Park; Bong-Chul Kim; Byung-Kyo Lee; Jin Jang
200106Development of AC-PDP tubeless packaging method and their operating characteristicsSeung-Woo Choi; 주병권; Duck-Jung Lee; 이윤희; 오명환; Gwon-Jin Moon; Jun-Dong Kim; Jin-Wook Jeoung; Young-Cho Kim
200108PDP tubeless packaging by using epoxy gluing process at room temperatureSeung-Il Moon; Duck-Jung Lee; 오명환; 이윤희; 주병권; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim
200103Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its applicationDuck-Jung Lee; 이윤희; Jin Jang; 주병권
200110Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensorsHeung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; 오명환; 주병권
200110Thin PDP packaging technology by direct-joint methodDuck-Jung Lee; 주병권; 이윤희; Yun-Kwon Park; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang; 오명환
200110PDP tubeless packaging using B-stage epoxySeung-Il Moon; Duck-Jung Lee; 오명환; 이윤희; 주병권; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim