직접접합과 전기화학적 식각정지법에 의한 SOI 기판 제작

Title
직접접합과 전기화학적 식각정지법에 의한 SOI 기판 제작
Authors
주병권김일명이승준강경두정수태정귀상
Keywords
wafer bonding
Issue Date
1999-11
Publisher
센서학회 종합학술대회
Citation
, 355-358
URI
http://pubs.kist.re.kr/handle/201004/18277
Appears in Collections:
KIST Publication > Conference Paper
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