Stress effect on interconnect reliability due to electromigration

Title
Stress effect on interconnect reliability due to electromigration
Authors
박영준주영창
Keywords
electromigration
Issue Date
1999-11
Publisher
Proc. of the Thirteenth Conference on Mechanical Behaviors of Materials
Citation
, 83-92
URI
http://pubs.kist.re.kr/handle/201004/18317
Appears in Collections:
KIST Publication > Conference Paper
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