Novel bonding technology for hermetically sealed silicon micropackage.

Title
Novel bonding technology for hermetically sealed silicon micropackage.
Authors
이덕중주병권최우범정지원이윤희장진이광배오명환
Keywords
FED; hydrophilization; anodic bonding; SDAB; tensile strength; SIMS analysis
Issue Date
1999-01
Publisher
Japanese Journal of Applied Physics, Part 1- Regular Papers
Citation
v. 38, no. 1A, 1-6
URI
http://pubs.kist.re.kr/handle/201004/18421
ISSN
0021-4922
Appears in Collections:
KIST Publication > Article
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