Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer

Title
Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer
Authors
W. B. Choi주병권이윤희오명환N. Y. LeeM. Y. Sung
Keywords
MEMS
Issue Date
1999-01
Publisher
Journal of materials science
Citation
VOL 34, 1-7
URI
http://pubs.kist.re.kr/handle/201004/18468
ISSN
0022-2461
Appears in Collections:
KIST Publication > Article
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