Effects PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect

Title
Effects PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect
Authors
김용태김동준이석형박영균김익수박종완
Keywords
PECVD; SiOF; W-N; diffusion barrier
Issue Date
1999-01
Publisher
Proc. of EOS/SPIE Symposium on Microelectronic Manufacturing Technologies
URI
http://pubs.kist.re.kr/handle/201004/18532
Appears in Collections:
KIST Publication > Conference Paper
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