Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging

Title
Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging
Authors
주병권이덕중정지원오명환정성재이남양고영욱이충훈한정인조경익최두진
Keywords
MEMS
Issue Date
1998-09
Publisher
IDRC '98
Citation
, 145-148
URI
http://pubs.kist.re.kr/handle/201004/18650
Appears in Collections:
KIST Publication > Conference Paper
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