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dc.contributor.author주병권-
dc.contributor.author오명환-
dc.date.accessioned2015-12-02T05:46:04Z-
dc.date.available2015-12-02T05:46:04Z-
dc.date.issued199812-
dc.identifier.citationv. 47, no. 12, 21-29-
dc.identifier.other8899-
dc.identifier.urihttp://pubs.kist.re.kr/handle/201004/19001-
dc.publisher전기학회지-
dc.publisherProceedings of KIEE-
dc.title기판 접합 공정 및 이를 이용한 MEMS/FED Packaging 기술동향 .-
dc.typeOther-
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