A study on low-temperature bonding of glass-silicon using modified direct bonding method

Title
A study on low-temperature bonding of glass-silicon using modified direct bonding method
Authors
주병권고창기이윤희강인병Paul WhiteNoel SamaanMalcolm Haskard오명환
Keywords
MEMS; wafer bonding; glass-Si direct bonding; New and low-temperature bonding method
Issue Date
1997-03
Publisher
전기학회논문지
Citation
VOL 46, NO 3, 450-455
URI
http://pubs.kist.re.kr/handle/201004/19597
Appears in Collections:
KIST Publication > Article
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