Si-Si electrostatic bonding using electron beam-evaporated corning #7740 as an interlayer

Title
Si-Si electrostatic bonding using electron beam-evaporated corning #7740 as an interlayer
Authors
주병권최우범이윤희정성재이남양성만영오명환
Keywords
MEMS; wafer bonding; interlayer; electrostatic bonding; Si-Si bonding; electron beam-evaporated #7740 interlayer
Issue Date
1997-10
Publisher
전기학회논문지
Citation
VOL 46, NO 10, 1562-1572
URI
http://pubs.kist.re.kr/handle/201004/19781
Appears in Collections:
KIST Publication > Article
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