Effect of wet-etching process on the gate insulator of metal tip FEA

Title
Effect of wet-etching process on the gate insulator of metal tip FEA
Authors
정유호주병권정재훈이윤희오명환김철주
Keywords
FED; wafer bonding; tubeless packaging
Issue Date
1997-01
Publisher
제1회 한국정보디스플레이 학술대회 논문집, KIST
Citation
, 137-138
URI
http://pubs.kist.re.kr/handle/201004/20022
Appears in Collections:
KIST Publication > Conference Paper
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