Anodic bonding technique under low-temperature and low-voltage using evaporated glass

Title
Anodic bonding technique under low-temperature and low-voltage using evaporated glass
Authors
최우범주병권S. J. JeongN. Y. LeeK. H. KohM. R. Haskard성만영오명환
Keywords
field emission display; micromachining; micropackaging; anodic bonding
Issue Date
1996-07
Publisher
Technical digest of 9th international vacuum microelectronics conference, St. Petersburg, Russia.
Citation
, 427-430
URI
http://pubs.kist.re.kr/handle/201004/20104
Appears in Collections:
KIST Publication > Conference Paper
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