Study on the bonding interface in directly-bonded Si-Si and Si-SiO2/Si wafer pairs

Title
Study on the bonding interface in directly-bonded Si-Si and Si-SiO2/Si wafer pairs
Authors
주병권방준호이윤희박종완차균현오명환
Keywords
micromachining; wafer bonding; bonding interface
Issue Date
1994-04
Publisher
한국재료학회지; Korean Journal of Materials Research
Citation
VOL 4, NO 2, 127-135
URI
http://pubs.kist.re.kr/handle/201004/21011
ISSN
1225-0562
Appears in Collections:
KIST Publication > Article
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