New method to improve thermal stability in the interface of silicon and tungsten by the interposition of plasma deposited tungsten nitride thin film.

Title
New method to improve thermal stability in the interface of silicon and tungsten by the interposition of plasma deposited tungsten nitride thin film.
Authors
김용태이창우이정용
Issue Date
1994-01
Publisher
Appl. phys. lett.
Citation
v. 64, 619-621
URI
http://pubs.kist.re.kr/handle/201004/21163
Appears in Collections:
KIST Publication > Article
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