Comparison of amorphous and polycrystalline tungsten nitride diffusion barrier for MOCVD-Cu metallization.

Title
Comparison of amorphous and polycrystalline tungsten nitride diffusion barrier for MOCVD-Cu metallization.
Authors
김용태권철순김동준이창우최인훈
Issue Date
1994-01
Publisher
Fall meeting of MRS
Citation
, ?-?
URI
http://pubs.kist.re.kr/handle/201004/21194
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE