Effect of residual stress on Si-condumptin during W-deposition by LPCVD.

Title
Effect of residual stress on Si-condumptin during W-deposition by LPCVD.
Authors
금동화H. C. YoonJ. J. lee
Issue Date
1990-01
Publisher
Advanced metallizations in microelectronics, MRS symposium proceedings
Citation
v. 201, 609-612
URI
http://pubs.kist.re.kr/handle/201004/22023
Appears in Collections:
KIST Publication > Conference Paper
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