Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects

Title
Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects
Authors
Vaibhav K. Andleigh박영준Carl V. Thompson
Keywords
electromigration; Simulation; stress evolution
Issue Date
1998-09
Publisher
SRC TechCon '98 conference proceedings, Las Vegas, Nevada, Sep. 9-14, 1998, Symposium 8.4
Citation
, 1-4
URI
http://pubs.kist.re.kr/handle/201004/22674
Appears in Collections:
KIST Publication > Conference Paper
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