N2+ implantation approaches for improving thermal stability of Cu/Mo/Si contact structure
- N2+ implantation approaches for improving thermal stability of Cu/Mo/Si contact structure
- 김용태; 김동준; 박종완
- diffusion barrier; N2+ implantation; thermal stability; Mo-nitride; stress
- Issue Date
- Japanese Journal of Applied Physics, Part 1- Regular Papers
- VOL 38, NO 5A, 2993-2996
- Appears in Collections:
- KIST Publication > Article
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