N2+ implantation approaches for improving thermal stability of Cu/Mo/Si contact structure

Title
N2+ implantation approaches for improving thermal stability of Cu/Mo/Si contact structure
Authors
김용태김동준박종완
Keywords
diffusion barrier; N2+ implantation; thermal stability; Mo-nitride; stress
Issue Date
1999-05
Publisher
Japanese Journal of Applied Physics, Part 1- Regular Papers
Citation
VOL 38, NO 5A, 2993-2996
URI
http://pubs.kist.re.kr/handle/201004/22765
ISSN
0021-4922
Appears in Collections:
KIST Publication > Article
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