Glass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stability

Title
Glass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stability
Authors
이덕중주병권장진오명환이윤희
Keywords
vacuum packaging
Issue Date
2000-01
Publisher
IEEE MEMS'2000
Citation
, 253-258
URI
http://pubs.kist.re.kr/handle/201004/22812
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE