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dc.contributor.author이덕중-
dc.contributor.author주병권-
dc.contributor.author장진-
dc.contributor.author오명환-
dc.contributor.author이윤희-
dc.date.accessioned2015-12-02T07:49:01Z-
dc.date.available2015-12-02T07:49:01Z-
dc.date.issued200001-
dc.identifier.citation, 253-258-
dc.identifier.other11936-
dc.identifier.urihttp://pubs.kist.re.kr/handle/201004/22812-
dc.publisherIEEE MEMS'2000-
dc.subjectvacuum packaging-
dc.titleGlass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stability-
dc.typeConference Paper-
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KIST Publication > Conference Paper
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