Enhancement of the electical and physical properties of Cu/W-N/HSQ interconnection scheme by NH₃ plasma treatment

Title
Enhancement of the electical and physical properties of Cu/W-N/HSQ interconnection scheme by NH₃ plasma treatment
Authors
김동준심현상김용태김춘근박종완
Keywords
W-N diffusion barrier
Issue Date
2000-06
Publisher
The International Conference on Electrical Engineering 2000
Citation
, 766-769
URI
http://pubs.kist.re.kr/handle/201004/22882
Appears in Collections:
KIST Publication > Conference Paper
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