Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

Title
Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints
Authors
C.K. Shin백영준허주열
Keywords
BGA solder joint; ball shear strength; Sn-Cu solder; intermetallic compound; fracture mode
Issue Date
2001-11
Publisher
Journal of electronic materials
Citation
VOL 30, NO 10, 1323-1331
URI
http://pubs.kist.re.kr/handle/201004/22924
ISSN
0361-5235
Appears in Collections:
KIST Publication > Article
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