A method of improving dielectric constant and adhesion strength of methyl silsesquioxane by using a NH3 plasma treatment

Title
A method of improving dielectric constant and adhesion strength of methyl silsesquioxane by using a NH3 plasma treatment
Authors
김용태
Keywords
LOW-K; MSQ; inter-level dielectirc재료; 다층배선; 초고집적소자
Issue Date
2001-11
Publisher
Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001
Citation
, Session C-2
URI
http://pubs.kist.re.kr/handle/201004/22931
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE