Characteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect.

Title
Characteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect.
Authors
김용태심현상
Keywords
구리배선; 펄스플라즈마; 원자층 증착; 텅스텐질화막; 초고집적소자; W-N; 확산방지막
Issue Date
2002-07
Publisher
2002 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD2
Citation
, 115-118
URI
http://pubs.kist.re.kr/handle/201004/23100
Appears in Collections:
KIST Publication > Conference Paper
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