3D 패키징 적용을 위한 박막 실리콘 기판을 이용한 RF-MEMS 패키징 .

Title
3D 패키징 적용을 위한 박막 실리콘 기판을 이용한 RF-MEMS 패키징 .
Authors
김용국박윤진김철주주병권
Keywords
RF MEMS; thin wafer; packaging
Issue Date
2003-02
Publisher
제 10 회 반도체학술대회
Citation
, 707-708
URI
http://pubs.kist.re.kr/handle/201004/23340
Appears in Collections:
KIST Publication > Conference Paper
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