A novel thin chip scale packaging of the RF-MEMS devices using ultra thin silicon.

Title
A novel thin chip scale packaging of the RF-MEMS devices using ultra thin silicon.
Authors
박윤권김용국김훈이덕중김철주주병권박정오
Keywords
Packaging; MEMS; thin silicon wafer
Issue Date
2003-01
Publisher
IEEE MEMS'03
Citation
, 618-621
URI
http://pubs.kist.re.kr/handle/201004/23370
Appears in Collections:
KIST Publication > Conference Paper
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