Effects of NH₃ plasma treatment on methyl silsequioxane for copper multi-level interconnect

Title
Effects of NH₃ plasma treatment on methyl silsequioxane for copper multi-level interconnect
Authors
심현상김용태전형탁
Keywords
플라즈마처리; Nitridation; inter-level dielectric; mechanical hardness; leakage current; 구리배선; 다층배선; ULSI; 반도체소자
Issue Date
2002-06
Publisher
Japanese Journal of Applied Physics Part 1
Citation
VOL 41, NO 6A, 3658-3661
URI
http://pubs.kist.re.kr/handle/201004/23434
ISSN
0021-4922
Appears in Collections:
KIST Publication > Article
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