Effects of NH₃ plasma treatment on methyl silsequioxane for copper multi-level interconnect
- Effects of NH₃ plasma treatment on methyl silsequioxane for copper multi-level interconnect
- 심현상; 김용태; 전형탁
- 플라즈마처리; Nitridation; inter-level dielectric; mechanical hardness; leakage current; 구리배선; 다층배선; ULSI; 반도체소자
- Issue Date
- Japanese Journal of Applied Physics Part 1
- VOL 41, NO 6A, 3658-3661
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- KIST Publication > Article
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