A Novel low-loss wafer-level packaging of the RF-MEMS devices

Title
A Novel low-loss wafer-level packaging of the RF-MEMS devices
Authors
Yun-Kwon ParkHeung-Woo ParkDuck-Jung leeJung-Ho ParkIn-Sang SongChung-Woo KimCi-Moon SongYun-Hi LeeChul-Ju Kim주병권
Keywords
wafer level packaging; RF-MEMS; bump; hermetic sealing; via hole
Issue Date
2002-01
Publisher
IEEE MEMS02 technical digest
Citation
, 681-684
URI
http://pubs.kist.re.kr/handle/201004/23570
Appears in Collections:
KIST Publication > Conference Paper
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