Effect of microstructure on the coefficient of thermal expansion and young's modulus in tungsten-copper composites

Title
Effect of microstructure on the coefficient of thermal expansion and young's modulus in tungsten-copper composites
Authors
이승익유명기문인형
Issue Date
2000-01
Publisher
2000 Advances in Powder Metallurgy & Particulate Materials
Citation
, 1-7
URI
http://pubs.kist.re.kr/handle/201004/23922
Appears in Collections:
KIST Publication > Conference Paper
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