Effects of precipitate distribution on electromigration in Al-Cu thin-film interconnects

Title
Effects of precipitate distribution on electromigration in Al-Cu thin-film interconnects
Authors
한준현신명철S. H. KangJ. W. Morris, Jr.
Keywords
electromigration; Al thin-film; Interconnect; precipitate
Issue Date
1998-08
Publisher
Applied physics letters
Citation
VOL 73, NO 6, 762-764
URI
http://pubs.kist.re.kr/handle/201004/24157
ISSN
0003-6951
Appears in Collections:
KIST Publication > Article
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