Effects of process parameters on the adhesion of copper film on polyethylene tetrephthalate(PET) substrate prepared by ECRMOCVD coupled with a periodic DC bias

Title
Effects of process parameters on the adhesion of copper film on polyethylene tetrephthalate(PET) substrate prepared by ECRMOCVD coupled with a periodic DC bias
Authors
현진전법주변동진이중기
Keywords
Cu film; ECR-MOCVD; DC bias; polymer substrate
Issue Date
2004-01
Publisher
Mat. Res. Soc. Symp. Proc.
Citation
VOL 795, 851-856
URI
http://pubs.kist.re.kr/handle/201004/25062
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE