A new pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect

Title
A new pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect
Authors
심현상김성일전형탁김용태
Keywords
atomic layer deposition; diffusion barrier; tungsten nitride; remote plasma
Issue Date
2003-10
Publisher
Japanese Journal of Applied Physics. Part 1
Citation
VOL 42, NO 10, 6359-6362
URI
http://pubs.kist.re.kr/handle/201004/25188
ISSN
0021-4922
Appears in Collections:
KIST Publication > Article
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