Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect

Title
Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
Authors
심현상김성일김용태
Issue Date
2003-07
Publisher
Journal of Vacuum Science & Technology, B
Citation
v. 21, no. 4, 1411-1414
URI
http://pubs.kist.re.kr/handle/201004/25214
ISSN
1071-1023
Appears in Collections:
KIST Publication > Article
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