Characteristics of Pulse Plasma Atomic Layer Deposited W-C-N Diffusion Barrier for Cu Interconnect

Title
Characteristics of Pulse Plasma Atomic Layer Deposited W-C-N Diffusion Barrier for Cu Interconnect
Authors
김용태Hyun Sang Sim박지호
Issue Date
2004-10
Publisher
The 206th Meeting of the Electrochemical Society in Honolulu
URI
http://pubs.kist.re.kr/handle/201004/26999
Appears in Collections:
KIST Publication > Conference Paper
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