Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

Title
Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis
Authors
Baik Woo Lee정증현Woosoon JangJu Young KimDong Won KimDongil KwonJae Woong NahKyung Wook Paik
Issue Date
2003-07
Publisher
International Journal of Modern Physics B
Citation
VOL 17, NO 8-9, 1983-1988
URI
http://pubs.kist.re.kr/handle/201004/27377
ISSN
0217-9792
Appears in Collections:
KIST Publication > Article
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