Experimental Study on Direct Bonding of GaAs and Si wafers for GOI Fabrication

Title
Experimental Study on Direct Bonding of GaAs and Si wafers for GOI Fabrication
Authors
박종국변영태박진우
Keywords
GOI (GaAs-on-insulator); 웨이퍼 직접 접합; Smart-cut
Issue Date
2005-10
Publisher
새물리
Citation
VOL 51, NO 4, 322-327
URI
http://pubs.kist.re.kr/handle/201004/28044
ISSN
0374-4914
Appears in Collections:
KIST Publication > Article
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE