Electron backscattered diffraction analysis of copper damascene interconnect for ultralarge-scale integration

Title
Electron backscattered diffraction analysis of copper damascene interconnect for ultralarge-scale integration
Authors
이효종김동익안정훈이동녕
Keywords
Anisotropy; Copper; Metallization; Nanostructures
Issue Date
2005-03
Publisher
Thin solid films
Citation
VOL 474, NO 1-2, 250-254
URI
http://pubs.kist.re.kr/handle/201004/28247
ISSN
0040-6090
Appears in Collections:
KIST Publication > Article
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