Optimized Condition for Direct Wafer Bonding of GaAs/SiNx/SiO2/Si for Hybrid Semiconductor Optical Devices

Title
Optimized Condition for Direct Wafer Bonding of GaAs/SiNx/SiO2/Si for Hybrid Semiconductor Optical Devices
Authors
박종국김선호박진우변영태
Keywords
반도체 광소자; GaAs/SiNx/SiO2/Si; 웨이퍼 직접 접합
Issue Date
2005-05
Publisher
제 12회 광전자 및 광통신 학술회의(COOC 2005)
Citation
, 7-8
URI
http://pubs.kist.re.kr/handle/201004/28259
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE