Characteristics of W-C-N thin film as a new diffusion barrier for Cu interconnection

Title
Characteristics of W-C-N thin film as a new diffusion barrier for Cu interconnection
Authors
이창우김용태박지호김희준
Keywords
W-C-N; diffusion barrier
Issue Date
2005-10
Publisher
2005 Korea-Japan joint workshop on advanced semiconductor processes and equipments
URI
http://pubs.kist.re.kr/handle/201004/28365
Appears in Collections:
KIST Publication > Conference Paper
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