Electrical Resistivity and Solder-Reaction Characteristics of Ni Films Fabricated by Electroplating

Title
Electrical Resistivity and Solder-Reaction Characteristics of Ni Films Fabricated by Electroplating
Authors
이광용원혜진전성우오택수변지영오태성
Keywords
Ni film; Electroplating; Electronic packaging; UBM; Electrical resistivity; Solder reaction
Issue Date
2005-09
Publisher
마이크로전자및패키징학회지 (Journal of Microelectronics and Packaging Society)
Citation
VOL 12, NO 3, 253-258
URI
http://pubs.kist.re.kr/handle/201004/28580
ISSN
12269360
Appears in Collections:
KIST Publication > Article
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