Electrical Resistivity and Solder-Reaction Characteristics of Ni Films Fabricated by Electroplating
- Electrical Resistivity and Solder-Reaction Characteristics of Ni Films Fabricated by Electroplating
- 이광용; 원혜진; 전성우; 오택수; 변지영; 오태성
- Ni film; Electroplating; Electronic packaging; UBM; Electrical resistivity; Solder reaction
- Issue Date
- 마이크로전자및패키징학회지 (Journal of Microelectronics and Packaging Society)
- VOL 12, NO 3, 253-258
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- KIST Publication > Article
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