Thermocompression bonding for wafer level hermetic packaging of RF-MEMS devices

Title
Thermocompression bonding for wafer level hermetic packaging of RF-MEMS devices
Authors
박길수서상원최우범김진상남산이종흔주병권
Keywords
wafer-level packaging; thermocompression bonding; hermetic packaging
Issue Date
2006-03
Publisher
센서학회지
Citation
VOL 15, NO 1, 58-64
URI
http://pubs.kist.re.kr/handle/201004/29073
ISSN
1225-5475
Appears in Collections:
KIST Publication > Article
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