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dc.contributor.author박길수-
dc.contributor.author서상원-
dc.contributor.author최우범-
dc.contributor.author김진상-
dc.contributor.author남산-
dc.contributor.author이종흔-
dc.contributor.author주병권-
dc.date.accessioned2015-12-02T08:41:20Z-
dc.date.available2015-12-02T08:41:20Z-
dc.date.issued200603-
dc.identifier.citationVOL 15, NO 1, 58-64-
dc.identifier.issn1225-5475-
dc.identifier.other22858-
dc.identifier.urihttp://pubs.kist.re.kr/handle/201004/29073-
dc.publisher센서학회지-
dc.subjectwafer-level packaging-
dc.subjectthermocompression bonding-
dc.subjecthermetic packaging-
dc.titleThermocompression bonding for wafer level hermetic packaging of RF-MEMS devices-
dc.typeArticle-
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