Improvement of adhesion properties for Cu films on the polyimide by plasma source ion implantation
- Improvement of adhesion properties for Cu films on the polyimide by plasma source ion implantation
- 홍주희; 이연희; 한승희; 김강진
- Auger electron spectroscopy (AES); Adhesion; PSII; Ion-beam deposition; Polyimide; Plasma source ion implantation
- Issue Date
- Surface & coatings technology
- VOL 201, NO 1-2, 197-202
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- KIST Publication > Article
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