Improvement of adhesion properties for Cu films on the polyimide by plasma source ion implantation

Title
Improvement of adhesion properties for Cu films on the polyimide by plasma source ion implantation
Authors
홍주희이연희한승희김강진
Keywords
Auger electron spectroscopy (AES); Adhesion; PSII; Ion-beam deposition; Polyimide; Plasma source ion implantation
Issue Date
2006-09
Publisher
Surface & coatings technology
Citation
VOL 201, NO 1-2, 197-202
URI
http://pubs.kist.re.kr/handle/201004/30126
ISSN
0257-8972
Appears in Collections:
KIST Publication > Article
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