Cationic surfactants for the Control of Overfill Bumps in Cu Superfilling

Title
Cationic surfactants for the Control of Overfill Bumps in Cu Superfilling
Authors
김수길다니엘 조젤토마스 모팻
Keywords
Cu; Electrodeposition; Superfilling; Bump
Issue Date
2006-12
Publisher
Journal of the Electrochemical Society
Citation
VOL 153, NO 12, C826-C833
URI
http://pubs.kist.re.kr/handle/201004/31771
ISSN
0013-4651
Appears in Collections:
KIST Publication > Article
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