Atomic layer deposition of W-C-N diffusion barrier and its thermal stability for Cu interconnects

Title
Atomic layer deposition of W-C-N diffusion barrier and its thermal stability for Cu interconnects
Authors
김용태
Issue Date
2007-09
Publisher
European Materials Research Society (E-MRS 2007 FALL MEETING)
Citation
, 98-98
URI
http://pubs.kist.re.kr/handle/201004/31873
Appears in Collections:
KIST Publication > Conference Paper
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