A Novel Al-Reflow Process Using Surface Modification by the ECR Plasma Treatment and Its Application to the 256Mbit DRAM

Title
A Novel Al-Reflow Process Using Surface Modification by the ECR Plasma Treatment and Its Application to the 256Mbit DRAM
Authors
박인선이상인위영진정우상최길현박창수박선후안성태이문용Y.K. KimR. Reynolds
Keywords
Al-Reflow; ECR Plasma Treatment; Contact filling; 256Mbit DRAM
Issue Date
1994-12
Publisher
Electron Devices Meeting, 1994, Technical Digest., International
Citation
, 109-112
URI
http://pubs.kist.re.kr/handle/201004/32758
Appears in Collections:
KIST Publication > Conference Paper
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