Study of fracture Mechanics in Testing Interfacial Fracture of Solder Joints

Title
Study of fracture Mechanics in Testing Interfacial Fracture of Solder Joints
Authors
방웅호문명운C.-U. KIM강석훈정재필오규환
Keywords
Solder joint reliability; intermetallic layer; tensile test; bump shear test; stress intensity factors (KI and KII)
Issue Date
2008-04
Publisher
Journal of electronic materials
Citation
VOL 37, NO 4, 417-428
URI
http://pubs.kist.re.kr/handle/201004/32895
ISSN
0361-5235
Appears in Collections:
KIST Publication > Article
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE